Plating Specialist, Silicon Assembly (Starlink)

Who you are

You are a detail-oriented individual with a strong interest in manufacturing processes, particularly in the field of electrochemical plating. You thrive in hands-on roles and are eager to learn about integrated circuit packaging and assembly. Your ability to monitor and optimize process parameters will be crucial in ensuring the quality and reliability of the products you deliver. You are comfortable working in a collaborative environment, engaging with engineers and leadership to achieve common goals. You have a proactive approach to problem-solving and are motivated by the challenge of building something from scratch.

What you'll do

As a Plating Specialist, you will operate and maintain electrochemical plating equipment, including copper electroplating tools and seed layer deposition systems. Your primary responsibility will be to achieve uniform metal deposition with controlled thickness and adhesion on patterned wafers. You will monitor and optimize plating process parameters such as current density, electrolyte composition, pH, temperature, and additive levels to ensure void-free fills and low defect rates. You will collaborate closely with IC packaging engineers and test engineers to troubleshoot and resolve any issues that arise during the plating process. Your role will also involve documenting process changes and improvements to enhance overall efficiency and quality.

What we offer

At SpaceX, you will be part of a mission-driven team dedicated to making space exploration a reality. We offer competitive compensation and benefits, along with opportunities for professional growth and development. You will work in a supportive environment that values innovation and collaboration, allowing you to contribute to groundbreaking projects like Starlink. Join us in our quest to provide reliable internet to the entire world and help shape the future of humanity in space.