Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for versatile and passionate IC Packaging Engineer to join our team!
Description
• You will be responsible for IC packaging development
• Work with cross-functional teams and lead SoC Package integration and architecture efforts
• Drive the industry with advanced package solutions, new material developments, and specs
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience
Preferred Qualifications
MS/PhD and 6+ years of experience in relevant industry.
We are looking for someone experienced in the semiconductor packaging and/or system integration.
Good understanding of multi-functional packaging areas: package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, FA and package-system integration.
Specialist in advanced packaging technologies (FOWLP/2.5D/3D): Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.
Excellent problem solving with strong physics and fundamentals.
Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
Basic knowledge of signal integrity/power integrity.
Ability to review schematics, package/PCB layout and designs in Allegro.
Responsibilities
Work with cross-functional domains through package definition process and deliver optimized solutions to meet electrical, mechanical, thermal requirements.
Test vehicle definition and execution working alongside foundries and OSATs for advanced packaging technologies (FOWLP, 2.5D, 3D, coreless MCM).
Well versed with DOE principles and statistical analyses to establish robust build plans for OSATs through NPI phase.
Lead package failure analysis and root cause investigations across multiple domains (wafer level processes, assembly, substrate), process excursions, and drive efficient issues resolution.
Apply advanced AI/ML and data analytics techniques to convert complex foundry and OSAT datasets into actionable insights that drive process optimization and yield improvement.
Eeo Content
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.
