Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. We have data center locations in the U.S., Europe, Singapore, and Japan, and customers across all industries. At Annapurna Labs USA, we develop and build the next generation of our cloud infrastructure with cutting edge technologies for machine learning, from ASIC Si chip to servers.
As a quality and reliability engineer in the team, you will work closely with other teams and vendors to ensure that the quality and reliability of our product meet our high standards and the customer requests, from the design stage all the way to the production. This will include conducting risk assessment and qualifying new products and changes in process and materials, preparing the test program and test fixtures for the reliability testing, monitoring and analyzing real-time yield/reliability data and providing feedbacks, leading customer returns analysis activities, driving the teams and vendors for the process/product improvements.
Key job responsibilities
Primary responsibilities:
1) Risk assessment for packaging design and packaging process development;
2) Device packaging quality and reliability qualification, including the plan, data collection/analysis, failure disposition and summary etc.
3) Packaging manufacturing quality control, non-conforming material disposition and improvement.
4) Quality and reliability control of the packaging build materials, including HBM and substrate etc.
5) PCN and quality and reliability document review.
6) Vendor Audit
Qualifications:
1) B.Sc. or M.Sc. degree in electrical engineering, material science and engineering or related fields.
2) Hands on working experience on device packaging and reliability qualification.
3) Working experience to drive packaging vendor for improvement.
4) 5+ years of working experience on device packaging quality and reliability.
5) Deep knowledge and experience in the Q&R fundamentals, data analysis and statistics fundamentals, Si device failure modes, VLSI IC design, Fab/assembly manufacturing, RMA, testing and failure analysis.
1. Working experience in FAB and/or Packaging manufacturing and familiar with process control, SPC etc.
2. Familiar with COWOS and Emib advanced packaging technology and manufacturing.
3. Experience on vendor audit.
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit
https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
