Job Description
Imagine what you could accomplish here. At Apple, innovative ideas rapidly evolve into industry-defining products. Do you have the drive and technical depth to make a meaningful impact? The engineers who work here have transformed entire industries through Apple Hardware innovations. That same rigor and creativity also guide our design methodologies — continually advancing performance, reliability, and sustainability across every generation of our products. As a core member of our best-in-class CAD organization, you will help shape next-generation electromagnetic analysis methodologies for advanced RFIC and multi-die designs. You will apply first-principles understanding of Maxwell’s equations and field theory to develop and validate EM simulation flows using Finite Element and Method of Moments techniques. Your work will involve modeling complex package and interposer structures, enabling high-accuracy extraction of S-parameters, and ensuring robust signal integrity, coupling, and shielding performance across advanced packaging and 3DIC systems. Join our team of world-leading engineers and contribute to the development of groundbreaking technologies that power the next generation of Apple products.
In this highly visible role, your primary responsibilities will include:
• Maintain and support state of the art leading vendors Electromagnetic Finite-Element 3D solvers and Method-of-Moments solvers.
• Streamline and automate SOC EM analysis CAD flow with ownership of the entire flow.
• Support and collaborate with design groups (Physical-design and integration, Circuit-design / Power / Package & System / Technology) on their Electromagnetics requirements for various post layout flows.
• Work side by side with EDA vendors and foundries for tool qualification, debug and enhancement.
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